Teledyne DALSA, a Teledyne Technologies company and a global leader in machine vision technology, announced the introduction of its BOA series of affordable, easy-to-use Smart cameras. Teledyne DALSA’s BOA products are highly integrated vision systems in a tiny smart camera package specifically designed for industrial use. The Teledyne DALSA CameraLink cameras come in a variety of sizes. With small cameras that fit in the palm of a hand, embedded systems can benefit from the performance CameraLink provides. Additionally, larger APS-C cameras are capable of high-resolution and high-frame rate performance to ensure that Teledyne DALSA can satisfy any application. Teledyne DALSA’s newest thermal cameras ideal for non-contact fever screening WATERLOO, Ontario, April 14, 2020 - Teledyne DALSA, a Teledyne Technologies company and global leader in digital. The Teledyne DALSA Calibir series features a compact, versatile and modular thermal imaging platform with either 640 x 480 (VGA) or 320 x 240 (QVGA) resolution. Running at 30 frames/s, these 17 µm pixel pitch uncooled micobolometer cameras capture thermal IR images in the long wave infrared band (8 μm to 14 μm).
The monochrome Falcon4 models feature CLHS interface.

The Falcon4-CLHS M4480 and M4400 cameras, announced today by Teledyne DALSA, are based on the Teledyne e2v Lince 11.2M monochrome image sensors and engineered for industrial imaging applications that require high-speed data transfer. The cameras feature CLHS interface and can utilize both CX4 and fiber optic cabling.
Both new Falcon4 models can achieve capture rates into the thousands of frames per second when run in Partial Scan Mode and regions of interest are specified and can reach pixel full well capacity of over 160 Ke when running in binning mode.
According to the manufacturer, the new cameras are applicable for machine vision industrial automation, flat panel display inspection, semiconductor inspection, PCB automated optical inspection, and aerial imaging, among other applications.
GET PRICING

To Learn More:
Contact: Teledyne DALSA
Headquarters: Waterloo, ON, Canada
Product: Falcon4-CHLS M4480 and M4400 cameras
Key Features: Lince 11.2M monochrome image sensors, CLHS interface, pixel full well capacity of over 160 Ke when running in binning mode, thousands of frames per second when run in Partial Scan Mode
What Teledyne DALSA says: View more information on the Falcon4-CHLS M4480 and M4400 cameras.
WATERLOO, Ontario, Feb. 09, 2021 (GLOBE NEWSWIRE) -- Teledyne Imaging, part of Teledyne Technologies [NYSE: TDY], is proud to introduce LACera, a significant step forward in CMOS capabilities for advanced imaging which will enable the next generation of scientific discovery. Exclusively developed by Teledyne Imaging, LACera advanced imaging technology draws on Teledyne's decades of expertise in CMOS sensor and camera development.

Scientific imaging, spanning x-ray to near infrared (NIR) regions, is critical to emerging applications in life and physical sciences. Applications as diverse as next generation genomics, astronomical photometry, ultra-high-resolution x-ray and electron imaging require CMOS sensors and cameras with low light sensitivity and speed. LACera CMOS technology delivers greater than 90% quantum efficiency and proprietary low noise architecture with up to 18-bit readout - a combination of performance not previously available in wafer scale sensors.

LACera technology will be exclusively featured in next generation CMOS cameras to be announced later this year and includes x-ray, EUV and VIS-NIR versions. With vast CMOS sensor and camera design capabilities, Teledyne is ready to serve the next generation of research and OEM customers. Visit www.LargeAreaCMOS.com (http://www.LargeAreaCMOS.com) for additional information on LACera CMOS technology.
About Teledyne Imaging
Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other's strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
All trademarks are registered by their respective companies.
Teledyne Imaging reserves the right to make changes at any time without notice.
Media Contact:
Geralyn Miller
Senior Manager, Global Media Relations
Tel: +1-519-886-6001 ext. 2187
Email: geralyn.miller@teledyne.com (mailto:geralyn.miller@teledyne.com)